Mechanical parts for industrial chassis

Univerzální rámeček s výřezem 2x USB pro P2102E

DS-1100 Front Bezel with 4x DB9, DIO

DS-1101 Front Bezel with 4x DB9, DIO

DS-1102 Front Bezel with 4x DB9, DIO

CMI Module with 4x RJ45 Ports, Intel® I210-AT GbE LAN, 1x Universal Bracket with 4x RJ45 Cutout for DX Series

Modul Mini-PCIe s 2x sériovými porty RS-232, 1x tenký kabel DB9

Modul Mini-PCIe s 2x sériovými porty RS-232, 2x tenký kabel DB9

Mini PCI-e 1-port 10/100/1000 Ethernet board Single-Lane (x1) PCI-Express with throughput up to 2.5Gbps Fully compliant with PCI-Express Base Specification Rev. 1.1 Integrated 10/100/1000Mbps transceiver IEEE 802.3, IEEE 802.3u, IEEE 802.3ab, and

Mini PCI-e 1-port 10/100/1000 Ethernet board Single-Lane (x1) PCI-Express with throughput up to 2.5Gbps Fully compliant with PCI-Express Base Specification Rev. 1.1 Integrated 10/100/1000Mbps transceiver IEEE 802.3, IEEE 802.3u, IEEE 802.3ab, and

Mini PCI-e 1-port 10/100/1000 Ethernet board Single-Lane (x1) PCI-Express with throughput up to 2.5Gbps Fully compliant with PCI-Express Base Specification Rev. 1.1 Integrated 10/100/1000Mbps transceiver IEEE 802.3, IEEE 802.3u, IEEE 802.3ab, and

3G UMTS/HSPA+ Module Operation Temperature -40 °C ~ +80 °C GSM/GPRS/EDGE Band (MHz): 850/900/1800/1900 WCDMA (MHz): 850/900/1800/1900/2100

4G IoT/M2M-optimized LTE Cat1 Module Operation Temperature -40 °C ~ +80 °C GSM/GPRS/EDGE Band (MHz): 900/1800 WCDMA (MHz): 850/900/2100 Maximum L1 datarate downlink: 10.3 Mbits/s Maximum L1 datarate uplink: 5.2 Mbits/s